Thermally conductive silicones are used in electronic devices to dissipate heat away from the component and the surrounding equipment. Modern devices are required to be smaller and more powerful and consequently generate more heat. It is imperative keep these devices cool in order to prolong the life of the equipment, reduce energy consumption and prevent damage to surrounding components.

There are many types of conductive silicone materials available including pastes, cured pads, RTVs, gels, adhesives, gap fillers and greases. Which one engineers choose will be governed by the application and dispensing method preferred. Techsil selects the best new products for each type:

Silicone Adhesives, RTVs, Pastes and Greases

These are applied in a thin layer of material between the electronic component and its heatsink in order to minimise its thermal resistance. Pastes and greases are non-curing, allowing rework. RTVs and adhesives are used to bond the heat sink to the component while also offering an effective heat transfer medium.

NEW! Momentive TIA250RZ Thermally Conductive Silicone Adhesive

This is a one-component, heat curable silicone adhesive. This product cures quickly with heat and adheres well to a variety of substrates without the use of a primer.

Key Features

  • Good thermal conductivity – 2.2 W/mK
  • Ready to use: one component
  • Low temperature, fast cure
  • Primerless adhesion to many types of substrates

Silicone Potting Compounds

Some heat generating circuits benefit from potting or encapsulation in a heatsink enclosure using a thermally conductive silicone potting compound. This has the benefit of providing both heat dissipation and environmental protection all in one.

NEW! – Momentive TIA216G Thermally Conductive Silicone Potting Compound

This is a 2-component, thermally conductive potting material. Its low viscosity allows the material to conform to intricate shapes of thermal interfaces and contributes to the reduction of contact interference in complex designs. It quickly cures to a soft rubber gel with exposure to heat and retains tacky adhesion on its cured surface.

Key Features

  • Good thermal conductivity – 1.6 W/mK
  • Low viscosity
  • Fast cure with exposure to heat
  • Room temperature cure possible
  • Easy to use 1:1 mix ratio by weight and volume
  • Repairable
  • Noncorrosive to metal
  • UL 94V-0
  • Temperature range from -40°C to 200°C

Silicone Thermal Gap Filler Pastes

Used as a liquid dispensed alternative to prefabricated thermal pads. They offer improved thermal dissipation thanks to excellent wet-out compared to rigid pads. As these fillers can be dispensed by automated systems there are used by sectors demanding higher production throughput, thinner bond lines, and reduced mechanical pressure on components and solder joints. As a further advantage any design changes that alter the position or types of components used can be accommodated quickly by changing the shape and volume of thermal material deposited. If automatic dispensing equipment is used, it can be reprogrammed, avoiding any need to reorder gap-filler pads in different sizes or shapes.

NEW! – Momentive TIA241GF Liquid-Dispensed Silicone Thermal Pad / Gap Filler

TIA241GF gap filler is a 2-component, soft, thermally conductive silicone material used to dissipate heat from electronic devices. Its non-slumping pasty consistency offers physical stability that can allow improved processing.

Key Features

  • Good thermal conductivity – 4.1 W/mK
  • Fast, low temperature cure
  • Convenient 1:1 mix ratio by weight
  • Retained softness after cure for enhanced stress relief during thermal cycling
  • Excellent slump resistance (stays in place)
  • Repairable
  • Flame retardant: UL94V-0 equivalent
  • Glass bead options available (180 & 250µm) for bond line thickness control

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For advice on any of Techsil’s thermally conductive materials or to request a datasheet or sample please contact