Increasing data rates, denser systems, and shrinking product footprints challenge designers to meet their system signal integrity needs. Samtec’s Silicon to Silicon System Optimization provides engineers the service, products, tools and resources to optimize the entire signal path from bare die to IC package and assembly to PCB to connectors and cable assemblies and back again. 

Samtec’s Silicon to Silicon System Optimization capabilities include the following:

  • Assisting IC layout designers to optimize power and signal integrity of the bare die during the IC design process
  • Developing complex, customized IC packaging and assembly solutions enabling maximum IC density, precision and ruggedness
  • Enabling PCB designers to create denser, faster PCBs by providing factory and field-based technical support to ensure signal chain optimization
  • Providing the products, tools, design expertise and consulting services to link high-speed signal chains between PCBs and through backplanes
  • Engineer industry standard and customized copper and optical cable assemblies at data rates up to 28Gbps and beyond

Our new Silicon-To-Silicon System Optimization Guide details more of our capabilities.  Samtec continues to introduce new silicon-to-silicon optimization tools like Channelyzer™.  Our Technology Centers™ harness application-specific skill sets while collaboratively architecting innovative connectivity solutions based on our core Solution Blocks.

Channelyzer™

Channelyzer™, Samtec’s online full channel simulation and analysis tool, delivers high-speed serial channel performance data and optimization strategies within 24 hours.  Leveraging user-defined system inputs, this easy-to-use tool provides the necessary data to re-enforce channel confidence.  Features of Channelyzer include:

  • Channel modeling defined by package model, connector selection, PCB material, trace type and length and other system variables
  • Produces results for standards (IEEE 802.3bj 100GBASE-KR4, OIF CEI-28G-SR, OIF CEI-28G-MR and OIF CEI-25G-LR) and transceivers at varying equalization levels and data rates
  • Generates individual receiver performance data per user-defined  Tx/Rx assignments
  • Channelyzer reporting details include:
  • Channel overview  and strategies for improved performance
  • Differential impedance, insertion loss, return loss, PSXT
  • Voltage bathtub curves
  • COM as a function of BER

Simulate and analyze your next high-speed serial channel at www.samtec.com/channelyzer.

Technology Centers™

Samtec Technology Centers develop and advance technologies and products that provide both performance and cost benefits. The goal is to ensure complete system optimization of the signal path from bare die to IC package and assembly to PCB to connectors and cable assemblies and back again. 

Signal Integrity Group: In-house signal integrity  expertise for complex applications, with live EE support available 24/7 worldwide. Advanced design support including Differential Vias™ and routing recommendations using Tri-Planar™ trace technology.

Teraspeed® Consulting: Signal integrity services team providing complete system design, full channel signal and power integrity analysis and modeling, thermal management, and signal integrity-optimized advanced IC packaging for 28+ Gbps and beyond.

Advanced Interconnect Design: High precision stamping, plating, molding, and automated assembly for fine pitch and array interconnects used for  board-to-board,  interposers,  backplane, and high speed/high density cable assemblies.

Microelectronics/IC Packaging: Precision die attach, ultra-fine pitch and low profile wire bond, flip chip, underfill, and dam and encapsulation, complete IC-to-board design, and support and manufacturing of IC packaging, substrates, micro high density interposers and micro optical engines. Learn more ast www.samtec.com/microelectronics.

Optical Group: Engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high density ganged passive optical panel solutions. Learn more at www.samtec.com/optics.

High Speed Cable Plant: R&D and manufacturing of precision extruded micro coax and twinax cable used for high speed / high density cable assemblies, including 26-38 AWG, 50/75/85/100 ohm impedance, and systems rated at 28+ Gbps. Learn more at www.samtec.com/cables.

Solution Blocks

Samtec is a $625M global manufacturer of a broad line of electronic interconnect solution blocks including IC-to-Board, Ultra Micro, High Speed Board-to-Board, High Speed Cables, Future-Proof/Active Optics, Flexible Stacking, and Micro/Rugged components and cables. Learn more at https://wwws.samtec.com/picturesearch/.

For more information on Samtec’s Silicon to Silicon System Optimization capabilities, please contact our local UK team:

SAMTEC UNITED KINGDOM 
11 Mollins Court
Westfield, Cumbernauld
Scotland G68 9HP
Tel: +44 01236 739292
Fax: +44 01236 727113
Email: scotland@samtec.com