A new solution using package technology to provide high-current capability and high-efficiency for automotive applications, including electric and hybrid vehicles has been released by Infineon Technologies.
The new TO package is compliant with JEDEC standard H-PSOF (Heatsink Plastic Small Outline Flat lead). The first available products using the H-PSOF package technology are 40V OptiMOS T2 power transistors offering up to 300A current capability in addition to ultra low R DS(on) values of only 0.76mO.
Higher performance power electronic components are integral for compliance with government regulations mandating higher standards for automotive fuel efficiency while also demanding lower overall emissions.
To meet these standards, power MOSFETs with current capability above 200A and R DS(on) below 1mO are needed to reduce conduction losses and improve overall efficiency. Previously, MOSFETs addressing these needs were not available for the automotive market.
With the H-PSOF package, 40V power MOSFETs with up to 300A current capability and R DS(on) of only 0.76m is provided. In addition, the overall dimensions and the height of the package is reduced compared to a standard D 2PAK package (TO-263) which is typically used in these types of applications.
Infineon Technologies
