A new phase change material that has a thermal conductivity of 3.5W/mk has been introduced by specialist designer and manufacturer of thermal management materials, Universal Science.
The company advises, a high level of thermal performance and a thin bond line are the two key enabling factors of its UniPhase 3500 material making it ideal for environments where a high degree of heat transfer is required over larger surface areas.
This new material is ideal for applications such as microprocessor /heatsink assemblies, automotive modules and motor drives as it is mess free and offers an element of consistency.
Screen printing can be carried out directly onto a heatsink, typically in a honeycomb pattern and to a recommended maximum thickness of 0.25mm. As this material is dry when applied there is no mess and the heatsink /interface material can be handled and shipped as one.
The material changes the first time it is elevated above 45 °C; this is typically when the device coupled to the heatsink, is powered up for the first time. As the material flows, micro air voids are filled and it conforms to differing surface textures meaning that heat transfer is maximised.
In continuous use the new material has a wide operating temperature range of -40 °C to 125 °C making it suitable for use in applications in challenging environments with high ambient temperatures.
Universal Science
