Liqui-Form™ 2000 is a highly conformable shear-thinning material that requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, and the product has a natural tack ensuring it forms around the component and stays in place in the application. A new video animation featuring Liqui-Form™ 2000 shows the product’s minimal expansion during dispending, a critical factor to device reliability.
When the Bergquist Liqui-Form™ 2000 is exposed to a lead-free reflow profile, it expands in a controlled manner. The components and Liqui-Form™ 2000 stay in place, and the VRM is successfully surface mounted to a PCBA. The Liqui-Form™ product line from Bergquist is expected to continue growing, with higher and lower viscosity materials being developed.
• Thermal Conductivity: 2.0 W/m-K
• Applies very low force on components
during assembly
• Low volumetric expansion
• Excellent chemical and mechanical stability
even at higher temperatures
• Ultra-conforming with excellent wet-out for
low stress interface applications
• No curing required
• Stable viscosity in storage and in the
application
Follow this link to see our video animation and/or to request a free sample kit. You can also visit the Bergquist website or call us on +31 (0) 35 538 0684 for more information.
