Micron and Intel have announced the availability of their 3D NAND technology, enabling SSDs the size of a stick of gum that can hold more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB.
The companies used techniques to stack layers of data storage cells vertically – in three dimensions – to deliver the world’s highest-density flash memory. By bringing more storage to fit in a smaller space, Intel and Micron help consumers and enterprise customers save significant cost, reduce power and add considerable performance. The 256Gb multilevel cell version of 3D NAND is sampling today with select partners, and the 384Gb triple-level cell design will begin sampling later this spring.
