Molex has announced the launch of its new comprehensive iPass+ High-Density Interconnect System, comprised of host-side board connectors, internal and external copper cable assemblies and Active Optical Cables (AOCs) capable of transporting SAS 3.0, 12 Gbps signals in lengths up to 100m. The enhanced iPass+ HD system is designed and engineered to meet the new performance standards for speed and density.
Jay Neer, Molex industry standards manager, noted: “The need for scaling enterprise storage solutions continues to grow, fuelled by the exponential growth of on-demand information and entertainment networks and big data analytics. Molex is proud to be first-to-market with a comprehensive, integrated SAS-3 interconnect solution that will enable data centre architects to design and deploy larger, faster and more reliable storage systems, and allow enterprise users to scale up their storage capabilities as their requirements evolve and grow.”
These new Molex products provide nearly double the density of current QSFP+ solutions making the iPass+ HD Interconnect System ideal for use in large-scale data centres and enterprise multi-rack storage systems, as well as RAIDs (Redundant Array of Individual Disks) and other data networking and storage applications. The HD products are fully compliant with SAS 3.0 (12 Gbps) systems and are backward compatible with SAS 2.1 (6 Gbps) systems.
The Molex iPass+ HD Interconnect family of products includes:
· External passive copper cable assemblies (4x and 8x)
· Internal passive cable assemblies (4x and 8x)
· External integrated cage and receptacles (4x, 8x and 16x)
· Internal right angle and vertical receptacles (4x, 8x and 16x)
· External Active Optical Cable assemblies (4x AOCs)
These products are also compatible with the data rates for 10 Gbps InfiniBand QDR, 10 Gbps Ethernet, 8 Gbps Fibre Channel, 40 Gbps (4x10G) Ethernet and 56 Gbps (4×14 Gbps) InfiniBand FDR.