In its Embedded World 2020 showcase, Congatec will be covering a varied run of topics surrounding the core focus of embedded edge computing, ranging from high-end edge servers to headless systems for ultra-low-power edge logic. Highlights include the upcoming PICMG COM-HPC standard, which congatec is driving with Christian Eder as chairman of the COM-HPC subcommittee, as well as congatec’s extended SMARC ecosystem for the NXP i.MX8 family, which is designed for the use of MIPI camera technology and artificial intelligence, among other things. The breadth of the spectrum will be underscored by a new starter kit for real time workload consolidation, as well as presentations from Basler and Hacarus. Fanless cooling solutions for particularly robust embedded servers and systems that can dissipate up to 100 watts of TDP will complete the Congatec Embedded World showcase.
“The developments around COM-HPC are significant as they establish a new standard for edge servers, and extend the success of COM Express into new application areas. This is why they take center stage in our presentation,” explains Martin Danzer, director of product management at Congatec: “What is also crucial is the fact that Congatec covers the range of embedded edge logic, from high-end edge servers to deeply embedded ultra-low-power edge logic based on Arm processors. We provide comprehensive OEM Hardware and Firmware support across all these platforms, ensuring optimum connectivity, highest security and most convenient remote maintenance together with vision and AI integration, which is becoming increasingly important in many edge devices. With these hardware-centric additional services, we offer our customers much more than simple interface support. We provide them with highly customized solution platforms for the easiest possible integration of their embedded edge computers.”
For more information on Congatec’s showing at Embedded World, click here.