VarioCAM® HD head offers high-resolution thermography for thermal analysis of electronic components in HD format
InfraTec offers with VarioCAM® HD head a high-performance infrared camera system that enables applications ranging from simulation, testing prototypes and process optimization to quality assurance. The thermal imaging cameras are based on uncooled microbolometer FPA detectors of the latest generation. With up to (1,024 × 768) IR pixels, the largest detector in its class delivers brilliant 16-bit thermography images. Thanks to the opto-mechanical MicroScan unit, IR image formats with a geometrical resolution of 3.1 MegaPixels are possible. With this technology, the thermal radiation of the measurement object strikes a rotating germanium disc and is deflected through a tumbling motion of the disc according to a precise pattern. As a result, the measurement object is depicted thermally without gap, which corresponds to a detector fill factor of 100%. The geometrical resolution rises to (2,048 × 1,536) IR pixels, which represent genuine temperature measurement values. In this way, detailed thermograms that ensure exact recording and measurement of electronic assemblies and components are created. The VarioCAM® HD head gains markedly in image sharpness and reproduction quality. Measurement errors due to geometry can reliably be avoided. Designed for continuous operation, the MicroScan technology suits for laboratory and in-line applications. In combination with an excellent thermal resolution of up to 20 mK, the thermal imaging cameras are suitable for sophisticated fixed mount stationary measurement and testing tasks.
Ideally Equipped
A look inside shows how adaptable the VarioCAM® HD head is. With GigE Vision and GenICam, the camera series supports industry-wide standards for data transfer and image processing. As a result, each model is not only usable through the efficient and convenient thermography software IRBIS® 3 from InfraTec, but – based on these standards – also allows easy integration into existing system environments.
Use the Right Software
Temperature differences in defective and intact structures often account for only a few milli- and microkelvin. VarioCAM® HD head provides the possibility to detect abnormal thermal behaviour via lock-in thermography on a PCB surface, in IC’s, stacked-die packages and multi-chip modules. This helps you to determine smallest defects like point and line shunts, oxide failures, transistor and diode failures – whether you are testing in-line during the manufacturing process or in laboratory. Thermography software IRBIS® 3 active is a sufficient tool for such ambitious material testing. It supports lock-in thermography with active electrical excitation of corresponding testing objects for the detection of defects and provides crucial benefit to your entire manufacturing chain. The software enables analysis with different active thermography methods. It offers superimposition of different views at the pixel level to pinpoint abnormalities at their location successfully and precisely. To gain more detailed information you can use high-frequency excitation during your measurements. Users can easily save, neatly organize and quickly retrieve various parameter settings, which provides a convenient operation of IRBIS® 3 active in daily life.
Camera series VarioCAM® HD head allows for the thermal analysis of structures in the micrometre range and provides a detailed representation of the temperature distribution on electronic assemblies and components. This helps you saving time, effort and costs while detecting and analysing defects on e.g. printed circuit boards.
Fast Optics Guarantee Precise Results
As a result of many years of cooperation with Jenoptik, InfraTec offers a wide spectrum of high-quality optics for the VarioCAM® HD head. For example, users can record tiny structures of up to 17 µm with the single microscope objective. This optic is just as impressive as the additional super-wide angle or telescopic lenses with light intensity of f/1.0 and multiple anti-reflective coatings. In this way, the thermography system ensures a maximum of flexibility and supports a constant high measurement quality with the most varied tasks.
Full Range of Equipment
This thermal imaging system is impressive in their stand-alone version as well as components of the turnkey automation solution ACTIVE-LIT – a modular test bench allowing non-contact failure inspection of semiconductor material during the manufacturing process. If you want to verify the thermal behaviour using lock-in thermography online on a microscopic level, this is the most comfortable way to do so.
Cameras, software, excitation sources, controllers, lenses – InfraTec provides a high quality stock of everything you need for testing electronic components based on more than 25 years of experience in applied thermography. This supports the successful handling of your measurement and testing tasks.
