Analog Devices’ (ADI) presence at European Microwave Week 2019 (Paris, September 29 – October 4, stand 590/585) will showcase the company’s comprehensive system-level capabilities that cover the entire RF and microwave spectrum.
The event takes place at a time of intense design activity in the RF/MW sector. 5G communications are in early deployment, even as the relevant standards are still being finalised. Transportation systems such as autonomous vehicles are calling for high-bandwidth, low-latency data links. The requirements of defence and aerospace are as demanding as ever: and instrumentation to develop the solutions must stay “ahead of the game”. In all these areas, ADI stands ready to aid customers in achieving their system design objectives.
A range of technology demonstrations, some featuring products and technologies not previously exhibited in Europe, will reaffirm ADI’s ability to support integration of its leading-edge semiconductor devices into RF, microwave and millimetre-wave applications and system-level solutions. Analog Devices experts will also present a number of focussed papers on specific design challenges at EuMW 2019.
Phased array prototyping
A recent introduction from ADI, intended to support system-level design in a broad range of RF applications, is a customisable system-on-module (SOM) that combines multiple highly configurable, wideband RF transceivers with powerful ARM A53 based digital processing cores and FPGA. The scalable modules are production-ready to simplify the path from development to deployment. In the demonstration the SOMs are shown applied to phased array prototyping. Wideband, 200MHz coherent channels characterise incoming RF energy to either geolocate the emitter or to maximise the carrier-to-interference ratio. Multiple modules (ADRV9009-ZU11EG) can be synchronised at the RF level in a PCIe backplane for massive MIMO (nxn) system prototyping.
mmW frequency synthesis
State-of-the-art frequency generation that is precise, low-noise and wideband is a fundamental building block in almost every system architecture. A demonstration on the ADI stand will showcase the company’s latest generation of wideband frequency synthesisers and tunable filters for millimeter-wave systems such as 5G and phased array radar. Unrivalled phase noise and frequency coverage come with small form factor and exceptionally low spurs to optimize applications.
Multi-Channel, Mixed-Signal RF Converter Platform
This demonstration illustrates how ADI stands ready to support system-level designers in the communications, defense, and instrumentation markets by providing a truly software configurable multi-channel radio front end.
The mixed-signal front-end (MxFE™) RF data converter platform featured in this demonstration combines high-performance analog and digital signal processing for a range of applications such as 4G LTE and 5G millimeter-wave (mmWave) radios, Phased Array Radar, Electronic Warfare systems, Electronic test and measurement systems, and DOCSIS 3.0 CMTS.
The AD9081 and AD9082 MxFE devices integrate eight and six RF data converters, respectively. The RF DACs are 16-bit 12GSPS DACs, and the ADCs are 12-bit 6GSPS on the AD9082 and 12-bit 4GSPS on the AD9081. The devices also integrate an on-chip clock multiplier, performance and power optimized digital signal processing DSP capability, and a JESD204C high speed SERDES interface capable of transmitting and received data at up to 24.75 Gbps per lane. Wide analog input bandwidth of about 7GHz on the RF ADCs enable direct sampling up to C-band frequencies.
Signal generator on a chip
ADI has long been a pioneer in the field of direct-to-RF systems, applying its semiconductor technology to wideband signal generation. A demonstration looks, in particular, to applications in sectors such as instrumentation and aerospace/defence. High levels of integration are once again the key to simplifying system-level architectures. The demonstration features a new direct to RF transmit subsystem. The complete vector signal generator on a chip eliminates costly costly baluns and interface challenges by providing a 50 Ohm single ended DC-coupled output.
ADI to present in the Microwave Application Seminars
In European Microwave Week’s series of Microwave Application Seminars, ADI’s Product Applications Engineering Director Eamon Nash will deliver a series of papers. Topics to be covered include;
– “A 10-40 GHz Chipset for mmWave Imaging and Other Wideband Receive Applications”, Tuesday, October 1, at 5:00pm – 5:20pm
– “Phased-Array System Design That Incorporates Component-Level Performance”, Wednesday, October 2 at 12:20pm – 12:40pm
– “Assessing the Accuracy of Keysight Sys-Parameters and NI AWR Software VSS AMP_F Modules”, Wednesday, October 2 at 3:40pm – 4:00pm.
European Microwave Week 2019 takes place at the Porte de Versailles Exhibition Centre, Paris, France, from September 29 to October 4. The Exhibition portion of the event is open from October 1 – 3. Full details are at https://www.eumweek.com/exhibition/exhibition_overview.html